Tupalero since: | November 13, 2022 12:43 |
City: | Tejteri Bāzār Chak |
Biography: | This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required. |
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